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Facilities
Processing
- SPiFF
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(the optical lithography cleanroom) at OU is open to researchers
at UA and OU for materials processing necessary in C-SPIN. This cleanroom
is specialized for processing III-V materials. Facilities at UA include
HiDEC (High Density Electronics Center), a 4,000 square foot cleanroom
staffed by eleven personnel for processing on five-inch silicon wafers.
Enumeration on the facilities that are locally available is found below.
- SPiFF Deposition Systems:
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An Edwards diffusion-pumped two-boat thermal evaporator for contact
metalization and a Kurt Lesker turbo-pumped RF- and DC- magnetron
sputtering system used for contact metalization and insulator
deposition, respectively.
- SPiFF Etching Systems:
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Inductively Coupled Plasma reactive ion
etcher (ICP-REI) will be purchased. This instrument will be dedicated
to etching of III-V and Silicon based materials.
- SPiFF Mask Aligner:
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Karl Suss Model MJB-3, with accessories.
- SPiFF Photoresist Spinner:
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Laurel Technologies WS-200-4NPP.
- SPiFF Ball Bonder:
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Marpei Enterprises Inc. MEI 12-4B, hybrid ball bonder with thermosonic bonding.
- UA Alloy Furnace:
- Accent Model RC2400 Alloying furnace (for making Hall contacts).
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