nDeposit a layer of SiO2 (silicon dioxide)
on the surface of the wafer to
serve as a barrier.
nSpin on the photoresist to the surface of the wafer
¡Standard methods are to use high spin coaters
nRPM:
nTime:
¡Produces a thin uniform layer of photoresist on the
wafer surface.
nUse red/amber light at this stage
n