_____________________________________________________________________________ CHANGES IN VERSION 5XH Deleted fatal error: via drill at coordinates (inches, in drill file) 2.49250, 0.69530 . This also means that the erroneous air wire returns to the Eagle board file. Corrected value of R8 so that it no longer refers to "Note 7" (*7), which no longer exists nor is relevent. Added 4 1.0 mm holes with 1.4 mm capture pads, top and bottom, for positioning of flex on electrical test adaptor at Microcontact. Changed scheme for sighting aligment marks on adjacent modules to notches; deleted slots. Updated version number on the flex. Corrected documetation error: changed 'JPA_' to 'JP1_' . _____________________________________________________________________________ CHANGES IN VERSION 5XG Release 2 Changes to documentation only. Included drawings for both the Notch Option and the Slot Option. Fabrication drawings completed. Set Zin to 75 Ohms Set R6 to 10 Ohms _____________________________________________________________________________ CHANGES IN VERSION 5XG Optimized signal routing in area around lower right corner 300 um alignment view hole. Added 4 1 mm holes in gaps between tails and flex hybrid for electrical test fixture alignment at Microcontact. The edges of these holes are nominally 900 um from the maximum cut length of the flex at the closest point of approach. Eliminated air wires in layout. In the case of AVDD, this was done by routing a redundant trace of zero width. This and other zero width traces are removed during post-processing of the Gerber files. _____________________________________________________________________________ CHANGES IN VERSION 5XF Moved C3 at the request of Genova - interfering with wire bonder clamps. Added slots in each corner in all layers for viewing alignment marks of adjacent module on stave. Added circles in the top metal at many places near the FE's for pattern recognition. DRC done and errors corrected Updated missing parts designators in schematic _____________________________________________________________________________ CHANGES IN VERSION 5XE Pigtail power pads relocated per Andreas' drawing of 2 Feb. Via's tripled on power lead-in traces. "H" pattern and "U" pattern on adjacent FE bond pads filled in completely. DGrid brought from FE-15 to position adjacent to CCK monitor pads at gap between JP1 and JP2. Makes possible connection of DGrid or CCK at edge connector by selection of which wire bond is made. Bridge pads JP1 widened to 550 um and affected areas re-routed, including repositioning of 1 mm alignment circles for loading with pick and place machinary. Removed R9 - reinserted R6 (connects VDet_return to VDDA). Various cleanups and fixes. _____________________________________________________________________________ CHANGES IN V5.XD Changed FE bond pads to 100 x 450 microns. Moved R13 & C22 - should be able to grow MCC-I2 without getting too close to these components. Enlarged VDD and DGnd traces feeding left side of MCC Added small grounding pad and opening through top solder mask for grounding MCC. Enlarged opening in solder mask over FE and MCC pads - now 300 microns clearance from either end of long axis of pads. Enlarged openings over practice pads to make more bonding area available. ______________________________________________________________________________ CHANGES IN V5.XC Enlarged bridge pads for test (JP1) on flex hybrid side to 400 x 1500 microns. Enlarged bridge pads for test (JP1) on tail side to 400 x 900 microns. Enlarged solder mask openings for JP1. Got rid of bogus air wires except one (same one that won't go away in v3 and v4). Renumbered flex to FPCB test bond pads to match that of edge connector. ______________________________________________________________________________ CHANGES IN V5.XB Enlarged soldered pads for 0402 and 0603 SMD's to AVX recommended size. Enlarged pigtail power pads to 900 x 1500 microns. Enlarged pigtail signal pads to 400 x 1500 microns. Enlarged pigtail bond pads solder mask opening. _____________________________________________________________________________ CHANGES IN VERSION V5.XA Fixed zero width line in Eagle drawing between GA0 and GA1 on FE12. Move Vcal to former position of RSIB on pigtail pads (still same on test pads). Added 0.1 capacitors between DGrid and VDDA on FE12 and FE14. Float Dgrid on all other FE's. Eliminated source termination resistors on DTO and DTO2. Connected NTC to test bond pads. Labled HV inputs: "HV" (left) and "HV_Return" (right) Put 300 micron holes in 4 corners back in layout. Widened pigtail bond pads. Enlarged bridge bond pads that are used for driving flex/module for test. Added bottom metal under all pigtail bond pads. Added more 100 micron wide practice pads. Added 500 micron wide practice pads. Moved "messy" routing leading from pigtail to bridge onto tail (routing on flex hybrid now much cleaner). Widened HV guard ring on 3 sides (not enough room on 4th side). _____________________________________________________________________________ TO BE DONE IN FINAL RELEASE Fix up fabrication drawings: Update layout pattern. Add locations of corner bond pads to dimensioned drawings. Fix up bridge and PT labeling. Vertical dimension of sensor alignment holes not given on page 1 of 4.x fab file, then it is given and other dims repeated on page 2. Release DXF and Gerber files. _______________________________________________________________________________ NOTES Limit of MCC growth: Can grow at least 0.5 mm, however, the more it grows, the closer it comes to C22, C1 and R13. So, it becomes a matter of whether we want to keep the MCC decoupling capacitors and how close we can come to R13 before mounting the MCC becomes a problem. Walter has given limits on growth of MCC along other three directions.